Unit-I - Issues and Challenges in VLSI Design, VLSI Design Methodology, VLSI DesignFlow, VLSI Design Hierarchy, VLSI Design Styles, CAD Technology. VLSIFabrication Technology: Basic Steps of Fabrication, CMOS p-Well and n-WellProcesses, Layout Design, Design Rules, Stick Diagram, Bi-CMOS FabricationProcess. Unit-II - CMOS Inverter: MOS Device Model with Sub-micron Effects, VTC Parameters(DC Characteristics), CMOS Propagation Delay, Parasitic Capacitance Estimation,Layout of an Inverter, Switching, Short-Circuit and Leakage Components ofEnergy and Power; Interconnects: Resistance, Capacitance Estimation, delays,Buffer Chains, Low Swing Drivers, Power Dissipation, and PerformanceOptimization of Digital Circuits by Logical Effort and Transistor Sizing. Unit-III - Combinational Logic Circuits: Static CMOS Logic Circuits: ComplementaryCMOS, Ratioed Logic, Pass Transistor Logic, Transmission Gate Logic, DCVSLogic, Dynamic CMOS Logic Circuits; Sequential Logic Circuits: Static Latchesand Registers, Dynamic Latches and Registers, Pulse Based Registers; SenseAmplifier Based Registers, Semiconductor Memories: Non-Volatile and VolatileMemory Devices, Flash Memories, SRAM, DRAM. Unit-IV - Design Capture Tools, Hardware Description Language: VHDL, Testing andVerification: Defects, Fault Models, Design Strategies for Testing, Chip Level andSystem Level Test Techniques, Packaging Technology. Of Face Warp For Pc Bystronic Bysoft 7 Download there. here.